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 Key Features

  • High Resolution: 384×288 thermal image with 12μm pixel pitch
  • Uncooled Vanadium Oxide sensor core
  • Dual Output: MIPI-CSI & CVBS (PAL) interface
  • Wide Lens FOV: 48° Horizontal, 34° Vertical, 59° Diagonal
  • Low NETD: ≤40mK @ F1.0 / 25℃
  • Ultra-low power consumption: <1.5W
  • Fast response: ~20ms latency
  • Compact and lightweight: Ideal for drones, robotics, inspection systems

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